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Electrical Interconnect
초고속 신호 전송용 케이블 어셈블리 HSLink I , II
Add to Basket Inquire now
초고속 신호 전송용 케이블 어셈블리 HSLink I , II


Low loss
Low Skew
Low Crosstalk
Low degradation
Controlled Impedance
Differential Signals
Fully Shielded
High Reliability
Full 2mm Density

Features
  • High Density 2mm Grid Connector Interface
    HSLink Interconnect cable assemblies are fully compatible with 2mm hardmetric backplane
    connectors according to IEC-61076-4-101.

  • Stackable at 100% Density
    HSLink assemblies are available in 5 or 5(+2)wafer.
    Wafers are stackable side by side on a 2mm pitch without loss of contacts between them.

  • Highly Reliable Contacts
    Gold plated, dual wiping, phosphor bronze contacts give reliable low resistance backplane
    post connection for life of systems.

  • Low Skew, Balanced Pair Cable
    Low dielectric constant fluoropolymer insulation provides higher signal speed, while precise
    cable geometry achieves very low signal skew and impedance control.

  • High Fidelity Signal Integrity
    Designed for high speed data transfer, the HSLink system gives exceptional fidelity,
    BER and Eye pattern at 250MHz, 622MHz and Giga speed.

  • Fully Shielded Interconnect System
    Complete cable and connector shielding yield closely controlled impedance, very low signal
    crosstalk and overall RFI/EMI protection.

  • Balanced Pair and Common Mode Signals
    The HSLink system is designed for low skew 100ohm balanced pair or high speed 50ohm
    common mode signals.

  • Approval and certificate
    UL Approved
    Quality control with ISO9001 compliance
2mm Hardmetric Interconnection System(5Rows)
  • 2mm Pitch Connector Compatibility
    AMP Z-pack3A FB
    FCI MILLIPACS 13A & METIAL3A
    CANNON TEMPUS3A
  • Self Latching System
  • Application with standard shroud
  • 2mm pitch 5x1 based wafer
  • Giga speed application
  • Stack able at Full 2mm density
  • Fully Shielded for Matched Impedance,
    Low Crosstalk & RFI/EMI Protection
  • High speed, Low Skew, Low Loss
    Controlled Impedance
    100 ohrn Balanced Pair Cable or 50 ohrn Single Ended
    Coaxial Cable
  • Different wire size upon application AWG 28,26

2mm Hardmetric High Fidelity Interconnection System(5+2Rows)
  • 2mm Pitch Connector Compatibility
    AMP Z-pack?A HM
    ERNI Errnet?A
    FCI MILLIPACS 2?A
  • High Density, Stackable, 2mm Pitch
    Connector Interface
  • Fully shielded 5(+2) based wafer
  • Giga speed application
  • Stack able at full 2mm density
  • Shielded for Matched Impedance,
    Low Crosstalk & RFI/EMI Protection
  • High speed, Low Skew, Low Loss
    Controlled Impedance
    100 ohrn Balanced Pair Cable or 50 ohrn
  • Single Ended
    Coaxial Cable
  • Different wire size upon application AWG 28,26


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[ 연락처 정보 ]
icon Company 아이텍테크놀러지
icon Address 서울 송파구 가락본동 31-1
(우:138-801) 한국
icon Phone 82 - 2 - 21407500
icon Fax 82 - 2 - 34017670
icon Homepage www.iteck.com
icon Contact 이종원 / 부장

 
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Tel : 82-2-2140-7500 Fax : 82-2-3401-7670