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Electrical Interconnect
고속 신호 전송용 케이블 어셈블리 LSLink I , II
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고속 신호 전송용 케이블 어셈블리 LSLink I , II

  • Cost effective
  • Up to 250 MHz
  • Differential Signals
  • High Reliability
  • Full 2mm Density

Feature

  • High Density 2mm Grid Connector Interface
    LSLink Interconnect cable assemblies are 100% compatible with 2mm hardmetric connectors systems.
  • Stackable at 100% Density
    LSLink assemblies are available individual 5 connect wafer modules and stackable in blocks of up to 25 wafers. Wafers can be butt mated to maintain full 2mm grid density even in combination with the HSLink shielded versions.
  • Highly Reliable Contacts
    Gold plated, dual wiping, phosphor bronze contacts give reliable low resistance backplane post connection for life of systems.
  • High Fidelity Signal Integrity
    Designed for up to 250MHz data transfer, the LSLink unshielded system gives exceptional fidelity, BER and Eye Pattern at 250MHz.
  • Balanced Pair Differential Signals
    The LSLink system was designed for 100ohm balanced pair cable also use for 50ohm common mode signals.
2mm Pitch Connector Compatibility
FCI METRAL3A
AMP Z-Pack3A FB
CANNON TEMPUS3A

2mm Pitch Connector Compatibility
ECIMILLIPAS3A
AMP Z-pack3A HM
ERNI Ermnet3A

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[ 연락처 정보 ]
icon Company 아이텍테크놀러지
icon Address 서울 송파구 가락본동 31-1
(우:138-801) 한국
icon Phone 82 - 2 - 21407500
icon Fax 82 - 2 - 34017670
icon Homepage www.iteck.com
icon Contact 이종원 / 부장

 
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Tel : 82-2-2140-7500 Fax : 82-2-3401-7670